AM29F032B150SD vs K3N6C1000E-TC150 feature comparison

AM29F032B150SD Spansion

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K3N6C1000E-TC150 Samsung Semiconductor

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SPANSION INC SAMSUNG SEMICONDUCTOR INC
Part Package Code SOIC TSOP2
Package Description SOP, TSOP2,
Pin Count 44 44
Reach Compliance Code compliant compliant
Access Time-Max 150 ns 150 ns
JESD-30 Code R-PDSO-G44 R-PDSO-G44
JESD-609 Code e3
Memory Density 33554432 bit 33554432 bit
Memory IC Type FLASH MASK ROM
Memory Width 8 16
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 44 44
Number of Words 4194304 words 2097152 words
Number of Words Code 4000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 4MX8 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TSOP2
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 240
Programming Voltage 5 V
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40 30
Base Number Matches 3 1
ECCN Code EAR99
HTS Code 8542.32.00.71
Alternate Memory Width 8
Length 18.41 mm
Seated Height-Max 1.2 mm
Supply Current-Max 0.05 mA
Terminal Pitch 0.8 mm
Width 10.16 mm

Compare AM29F032B150SD with alternatives

Compare K3N6C1000E-TC150 with alternatives