AM29F032B150ED vs AM29F032B150FIB feature comparison

AM29F032B150ED Spansion

Buy Now Datasheet

AM29F032B150FIB AMD

Buy Now Datasheet
Rohs Code Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SPANSION INC ADVANCED MICRO DEVICES INC
Part Package Code TSOP TSOP
Package Description SOP, REVERSE, TSOP-40
Pin Count 40 40
Reach Compliance Code compliant unknown
Access Time-Max 150 ns 150 ns
JESD-30 Code R-PDSO-G40 R-PDSO-G40
JESD-609 Code e3
Memory Density 33554432 bit 33554432 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 40 40
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 4MX8 4MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40
Base Number Matches 1 2
ECCN Code EAR99
HTS Code 8542.32.00.51
Type NOR TYPE

Compare AM29F032B150ED with alternatives

Compare AM29F032B150FIB with alternatives