AM29F032B150FIB vs AM29F032B150FCB feature comparison

AM29F032B150FIB AMD

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AM29F032B150FCB Spansion

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC SPANSION INC
Part Package Code TSOP TSOP
Package Description REVERSE, TSOP-40 REVERSE, TSOP-40
Pin Count 40 40
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 150 ns 150 ns
JESD-30 Code R-PDSO-G40 R-PDSO-G40
Memory Density 33554432 bit 33554432 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 40 40
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 4MX8 4MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Type NOR TYPE NOR TYPE
Base Number Matches 2 2
Rohs Code No
JESD-609 Code e0
Moisture Sensitivity Level 3
Terminal Finish TIN LEAD

Compare AM29F032B150FIB with alternatives

Compare AM29F032B150FCB with alternatives