AM29BL162CB70RZI vs M29F160BB55N6 feature comparison

AM29BL162CB70RZI AMD

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M29F160BB55N6 STMicroelectronics

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer ADVANCED MICRO DEVICES INC STMICROELECTRONICS
Part Package Code SSOP TSOP
Package Description SOP, 12 X 20 MM, PLASTIC, TSOP-48
Pin Count 56 48
Reach Compliance Code unknown not_compliant
Access Time-Max 70 ns 55 ns
Additional Feature 20-YEAR DATA RETENTION BOTTOM BOOT BLOCK
JESD-30 Code R-PDSO-G56 R-PDSO-G48
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 56 48
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1MX16 1MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 5 V
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Base Number Matches 2 2
Rohs Code No
ECCN Code EAR99
HTS Code 8542.32.00.51
Alternate Memory Width 8
Boot Block BOTTOM
Command User Interface YES
Data Polling YES
JESD-609 Code e0
Length 18.4 mm
Number of Sectors/Size 1,2,1,31
Package Equivalence Code TSSOP48,.8,20
Ready/Busy YES
Seated Height-Max 1.2 mm
Sector Size 16K,8K,32K,64K
Standby Current-Max 0.00015 A
Supply Current-Max 0.02 mA
Terminal Finish TIN LEAD
Terminal Pitch 0.5 mm
Toggle Bit YES
Type NOR TYPE
Width 12 mm

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