AM29BL162CB-80RDPH1 vs AM29BL162CB-80RDWI1 feature comparison

AM29BL162CB-80RDPH1 Spansion

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AM29BL162CB-80RDWI1 AMD

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SPANSION INC ADVANCED MICRO DEVICES INC
Part Package Code DIE WAFER
Package Description DIE, DIE OR CHIP WAFER-52
Pin Count 52 52
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 80 ns 80 ns
Additional Feature BOTTOM BOOT BLOCK
Boot Block BOTTOM BOTTOM
Command User Interface YES
Data Polling YES
JESD-30 Code R-XUUC-N52 R-XUUC-N52
JESD-609 Code e0
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Sectors/Size 1,2,1,7
Number of Terminals 52 52
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 145 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 1MX16 1MX16
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIE DIE
Package Equivalence Code DIE OR CHIP
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP UNCASED CHIP
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Ready/Busy YES
Sector Size 8K,4K,112K,128K
Standby Current-Max 0.000035 A
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form NO LEAD NO LEAD
Terminal Position UPPER UPPER
Toggle Bit YES
Type NOR TYPE NOR TYPE
Base Number Matches 2 3

Compare AM29BL162CB-80RDPH1 with alternatives

Compare AM29BL162CB-80RDWI1 with alternatives