AM29BL162CB-80RDWI1
vs
AM29BL162CB-80RDTK1
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
SPANSION INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| Access Time-Max |
80 ns
|
80 ns
|
| Boot Block |
BOTTOM
|
BOTTOM
|
| Command User Interface |
YES
|
|
| Data Polling |
YES
|
|
| Memory Density |
16777216 bit
|
16777216 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Number of Sectors/Size |
1,2,1,7
|
|
| Number of Words |
1048576 words
|
1048576 words
|
| Number of Words Code |
1000000
|
1000000
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Organization |
1MX16
|
1MX16
|
| Package Equivalence Code |
DIE OR CHIP
|
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Power Supplies |
3.3 V
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Ready/Busy |
YES
|
|
| Sector Size |
8K,4K,112K,128K
|
|
| Standby Current-Max |
0.000035 A
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Toggle Bit |
YES
|
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Base Number Matches |
3
|
1
|
| Part Package Code |
|
DIE
|
| Package Description |
|
DIE-52
|
| Pin Count |
|
52
|
| ECCN Code |
|
3A001.A.2.C
|
| HTS Code |
|
8542.32.00.51
|
| Additional Feature |
|
BOTTOM BOOT BLOCK
|
| JESD-30 Code |
|
R-XUUC-N52
|
| JESD-609 Code |
|
e3
|
| Memory Width |
|
16
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
52
|
| Operating Mode |
|
ASYNCHRONOUS
|
| Package Body Material |
|
UNSPECIFIED
|
| Package Code |
|
DIE
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
UNCASED CHIP
|
| Programming Voltage |
|
3 V
|
| Supply Voltage-Max (Vsup) |
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
|
3 V
|
| Surface Mount |
|
YES
|
| Terminal Finish |
|
TIN
|
| Terminal Form |
|
NO LEAD
|
| Terminal Position |
|
UPPER
|
|
|
|
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