AM29BDS640HE9VMI vs AM29BDS640HE9VMF feature comparison

AM29BDS640HE9VMI AMD

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AM29BDS640HE9VMF Spansion

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC SPANSION INC
Package Description , 8 X 9 MM, 0.80 MM PITCH, FPBGA-64
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Base Number Matches 3 1
Part Package Code BGA
Pin Count 64
Access Time-Max 55 ns
Additional Feature SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
Boot Block BOTTOM/TOP
JESD-30 Code R-PBGA-B64
Length 8.95 mm
Memory Density 67108864 bit
Memory IC Type FLASH
Memory Width 16
Number of Functions 1
Number of Terminals 64
Number of Words 4194304 words
Number of Words Code 4000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 4MX16
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 1.8 V
Qualification Status Not Qualified
Seated Height-Max 1 mm
Supply Voltage-Max (Vsup) 1.95 V
Supply Voltage-Min (Vsup) 1.65 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Type NOR TYPE
Width 7.95 mm

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