AM29BDS640HE9VMI
vs
AM29BDS640HE9VMF
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
SPANSION INC
Package Description
,
8 X 9 MM, 0.80 MM PITCH, FPBGA-64
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Base Number Matches
3
1
Part Package Code
BGA
Pin Count
64
Access Time-Max
55 ns
Additional Feature
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
Boot Block
BOTTOM/TOP
JESD-30 Code
R-PBGA-B64
Length
8.95 mm
Memory Density
67108864 bit
Memory IC Type
FLASH
Memory Width
16
Number of Functions
1
Number of Terminals
64
Number of Words
4194304 words
Number of Words Code
4000000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
4MX16
Package Body Material
PLASTIC/EPOXY
Package Code
VFBGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Programming Voltage
1.8 V
Qualification Status
Not Qualified
Seated Height-Max
1 mm
Supply Voltage-Max (Vsup)
1.95 V
Supply Voltage-Min (Vsup)
1.65 V
Supply Voltage-Nom (Vsup)
1.8 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
BALL
Terminal Pitch
0.8 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Type
NOR TYPE
Width
7.95 mm
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