AM29BDS640HE9VMF vs M29W640GH90ZF6E feature comparison

AM29BDS640HE9VMF Spansion

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M29W640GH90ZF6E STMicroelectronics

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SPANSION INC STMICROELECTRONICS
Part Package Code BGA BGA
Package Description 8 X 9 MM, 0.80 MM PITCH, FPBGA-64 TBGA, BGA64,8X8,40
Pin Count 64 64
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 55 ns 90 ns
Additional Feature SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
Boot Block BOTTOM/TOP
JESD-30 Code R-PBGA-B64 R-PBGA-B64
Length 8.95 mm 13 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 64 64
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 4MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA TBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Programming Voltage 1.8 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 1.2 mm
Supply Voltage-Max (Vsup) 1.95 V 3.6 V
Supply Voltage-Min (Vsup) 1.65 V 2.7 V
Supply Voltage-Nom (Vsup) 1.8 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 40
Type NOR TYPE NOR TYPE
Width 7.95 mm 10 mm
Base Number Matches 1 3
Rohs Code Yes
Alternate Memory Width 8
Command User Interface YES
Common Flash Interface YES
Data Polling YES
Number of Sectors/Size 128
Package Equivalence Code BGA64,8X8,40
Page Size 4/8 words
Ready/Busy YES
Sector Size 64K
Standby Current-Max 0.0001 A
Supply Current-Max 0.01 mA
Toggle Bit YES

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