AM29BDS640HE9VMI
vs
AM29BDS640HE8VMI
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
SPANSION INC
Package Description
,
8 X 9 MM, 0.80 MM PITCH, FPBGA-64
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Base Number Matches
3
3
Rohs Code
Part Package Code
BGA
Pin Count
64
Access Time-Max
55 ns
Additional Feature
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
Boot Block
BOTTOM/TOP
Command User Interface
YES
Common Flash Interface
YES
Data Polling
YES
JESD-30 Code
R-PBGA-B64
JESD-609 Code
e0
Length
8.95 mm
Memory Density
67108864 bit
Memory IC Type
FLASH
Memory Width
16
Moisture Sensitivity Level
3
Number of Functions
1
Number of Sectors/Size
16,126
Number of Terminals
64
Number of Words
4194304 words
Number of Words Code
4000000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
4MX16
Package Body Material
PLASTIC/EPOXY
Package Code
VFBGA
Package Equivalence Code
BGA64,8X8,32
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
260
Programming Voltage
1.8 V
Qualification Status
Not Qualified
Ready/Busy
YES
Seated Height-Max
1 mm
Sector Size
4K,32K
Standby Current-Max
0.00004 A
Supply Current-Max
0.06 mA
Supply Voltage-Max (Vsup)
1.95 V
Supply Voltage-Min (Vsup)
1.65 V
Supply Voltage-Nom (Vsup)
1.8 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
Terminal Pitch
0.8 mm
Terminal Position
BOTTOM
Toggle Bit
YES
Type
NOR TYPE
Width
7.95 mm
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