AM29BDS640HE8VMI
vs
S29GL064N90FAI023
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
SPANSION INC
Reach Compliance Code
compliant
not_compliant
Access Time-Max
50 ns
90 ns
Boot Block
BOTTOM/TOP
Command User Interface
YES
YES
Common Flash Interface
YES
YES
Data Polling
YES
YES
JESD-30 Code
S-PBGA-B64
R-PBGA-B64
Memory Density
67108864 bit
67108864 bit
Memory IC Type
FLASH
FLASH
Number of Sectors/Size
16,126
128
Number of Terminals
64
64
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
4MX16
4MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FBGA
LBGA
Package Equivalence Code
BGA64,8X8,32
BGA64,8X8,40
Package Shape
SQUARE
RECTANGULAR
Package Style
GRID ARRAY, FINE PITCH
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Power Supplies
1.8 V
Qualification Status
Not Qualified
Not Qualified
Ready/Busy
YES
YES
Sector Size
4K,32K
64K
Standby Current-Max
0.00004 A
0.000005 A
Supply Current-Max
0.06 mA
0.05 mA
Supply Voltage-Nom (Vsup)
1.8 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Toggle Bit
YES
YES
Type
NOR TYPE
NOR TYPE
Base Number Matches
3
2
Pbfree Code
Part Package Code
BGA
Package Description
13 X 11 MM, FBGA-64
Pin Count
64
ECCN Code
EAR99
HTS Code
8542.32.00.51
Alternate Memory Width
8
JESD-609 Code
e0
Length
13 mm
Memory Width
16
Moisture Sensitivity Level
3
Number of Functions
1
Operating Mode
ASYNCHRONOUS
Page Size
8/16 words
Peak Reflow Temperature (Cel)
260
Programming Voltage
3 V
Seated Height-Max
1.4 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Terminal Finish
TIN LEAD
Width
11 mm
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