AM29BDS320GBD9VMF vs K8P3315UQB-EI4C feature comparison

AM29BDS320GBD9VMF Spansion

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K8P3315UQB-EI4C Samsung Semiconductor

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Rohs Code Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer SPANSION INC SAMSUNG SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description 8 X 9 MM, 0.80 MM PITCH, FBGA-64 LBGA,
Pin Count 64 64
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 70 ns 65 ns
Additional Feature SYNCHRONOUS BURST ACCESS ALSO POSSIBLE TOP AND BOTTOM BOOT BLOCK
Boot Block BOTTOM BOTTOM/TOP
JESD-30 Code R-PBGA-B64 R-PBGA-B64
JESD-609 Code e1
Length 8.95 mm 13 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 64 64
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 1.8 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 1.3 mm
Supply Voltage-Max (Vsup) 1.95 V 3.6 V
Supply Voltage-Min (Vsup) 1.65 V 2.7 V
Supply Voltage-Nom (Vsup) 1.8 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 1 mm
Terminal Position BOTTOM BOTTOM
Type NOR TYPE
Width 7.95 mm 11 mm
Base Number Matches 1 3

Compare AM29BDS320GBD9VMF with alternatives

Compare K8P3315UQB-EI4C with alternatives