K8P3315UQB-EI4C
vs
AM29LV320ML101RPCF
feature comparison
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
ADVANCED MICRO DEVICES INC
|
Part Package Code |
BGA
|
|
Package Description |
LBGA,
|
,
|
Pin Count |
64
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Access Time-Max |
65 ns
|
|
Additional Feature |
TOP AND BOTTOM BOOT BLOCK
|
|
Boot Block |
BOTTOM/TOP
|
|
JESD-30 Code |
R-PBGA-B64
|
|
Length |
13 mm
|
|
Memory Density |
33554432 bit
|
|
Memory IC Type |
FLASH
|
|
Memory Width |
16
|
|
Number of Functions |
1
|
|
Number of Terminals |
64
|
|
Number of Words |
2097152 words
|
|
Number of Words Code |
2000000
|
|
Operating Mode |
SYNCHRONOUS
|
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
2MX16
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
LBGA
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
GRID ARRAY
|
|
Parallel/Serial |
PARALLEL
|
|
Programming Voltage |
3 V
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.3 mm
|
|
Supply Voltage-Max (Vsup) |
3.6 V
|
|
Supply Voltage-Min (Vsup) |
2.7 V
|
|
Supply Voltage-Nom (Vsup) |
3 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Form |
BALL
|
|
Terminal Pitch |
1 mm
|
|
Terminal Position |
BOTTOM
|
|
Width |
11 mm
|
|
Base Number Matches |
1
|
2
|
|
|
|
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