AM28F010-70FEB
vs
CY7C269-15DC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Contact Manufacturer
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
CYPRESS SEMICONDUCTOR CORP
Package Description
TSSOP,
DIP, DIP28,.3
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.51
8542.32.00.71
Access Time-Max
70 ns
12 ns
JESD-30 Code
R-PDSO-G32
R-GDIP-T28
JESD-609 Code
e0
e0
Length
18.4 mm
Memory Density
1048576 bit
65536 bit
Memory IC Type
FLASH
OTP ROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
28
Number of Words
131072 words
8192 words
Number of Words Code
128000
8000
Operating Mode
ASYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
128KX8
8KX8
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
TSSOP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
12 V
Seated Height-Max
1.2 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.5 mm
2.54 mm
Terminal Position
DUAL
DUAL
Type
NOR TYPE
Width
8 mm
Base Number Matches
2
1
Pbfree Code
Rohs Code
Part Package Code
DIP
Pin Count
28
Additional Feature
DIAGNOSTIC PROM
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
DIP28,.3
Qualification Status
Not Qualified
Standby Current-Max
0.12 A
Supply Current-Max
0.12 mA
Compare AM28F010-70FEB with alternatives
Compare CY7C269-15DC with alternatives