AM27X800-255JI vs XC17V08PCG44I feature comparison

AM27X800-255JI AMD

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XC17V08PCG44I AMD Xilinx

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC XILINX INC
Part Package Code LCC LCC
Package Description QCCJ, LDCC44,.7SQ QCCJ,
Pin Count 44 44
Reach Compliance Code unknown compliant
ECCN Code EAR99 3A991.B.1.B.1
HTS Code 8542.32.00.71 8542.32.00.51
Access Time-Max 250 ns
Additional Feature EXPRESS
Alternate Memory Width 16
JESD-30 Code S-PQCC-J44 S-PQCC-J44
JESD-609 Code e0 e3
Length 16.5862 mm 16.5862 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type OTP ROM CONFIGURATION MEMORY
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 44 44
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1MX8 1MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC44,.7SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL/SERIAL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm 4.57 mm
Standby Current-Max 0.0001 A
Supply Current-Max 0.05 mA
Supply Voltage-Max (Vsup) 5.25 V 3.6 V
Supply Voltage-Min (Vsup) 4.75 V 3 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) Matte Tin (Sn)
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Width 16.5862 mm 16.5862 mm
Base Number Matches 1 1
Pbfree Code Yes
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30

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