AM27X256-70JI
vs
AT27C256R-70JK
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
MICROCHIP TECHNOLOGY INC
Reach Compliance Code
compliant
compliant
Base Number Matches
3
2
Rohs Code
Package Description
PLASTIC, MS-016AE, LCC-32
ECCN Code
EAR99
HTS Code
8542.32.00.71
Access Time-Max
70 ns
JESD-30 Code
R-PQCC-J32
JESD-609 Code
e3
Length
13.97 mm
Memory Density
262144 bit
Memory IC Type
OTP ROM
Memory Width
8
Moisture Sensitivity Level
3
Number of Functions
1
Number of Terminals
32
Number of Words
32768 words
Number of Words Code
32000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-40 °C
Organization
32KX8
Package Body Material
PLASTIC/EPOXY
Package Code
QCCJ
Package Shape
RECTANGULAR
Package Style
CHIP CARRIER
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
3.556 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
AUTOMOTIVE
Terminal Finish
MATTE TIN
Terminal Form
J BEND
Terminal Pitch
1.27 mm
Terminal Position
QUAD
Width
11.43 mm
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