AM27X256-150JC
vs
M27C256B-25XC6TR
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
STMICROELECTRONICS
|
| Reach Compliance Code |
compliant
|
compliant
|
| Base Number Matches |
3
|
1
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
QFJ
|
| Package Description |
|
LEAD FREE, PLASTIC, LCC-32
|
| Pin Count |
|
32
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.32.00.71
|
| Access Time-Max |
|
150 ns
|
| I/O Type |
|
COMMON
|
| JESD-30 Code |
|
R-PQCC-J32
|
| JESD-609 Code |
|
e3
|
| Length |
|
13.97 mm
|
| Memory Density |
|
262144 bit
|
| Memory IC Type |
|
OTP ROM
|
| Memory Width |
|
8
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
32
|
| Number of Words |
|
32768 words
|
| Number of Words Code |
|
32000
|
| Operating Mode |
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
|
32KX8
|
| Output Characteristics |
|
3-STATE
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
QCCJ
|
| Package Equivalence Code |
|
LDCC32,.5X.6
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
CHIP CARRIER
|
| Parallel/Serial |
|
PARALLEL
|
| Programming Voltage |
|
12.75 V
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
3.56 mm
|
| Standby Current-Max |
|
0.0001 A
|
| Supply Current-Max |
|
0.03 mA
|
| Supply Voltage-Max (Vsup) |
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
|
4.75 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
MATTE TIN
|
| Terminal Form |
|
J BEND
|
| Terminal Pitch |
|
1.27 mm
|
| Terminal Position |
|
QUAD
|
| Width |
|
11.43 mm
|
|
|
|
Compare M27C256B-25XC6TR with alternatives