AM27X1024-150PCXXXXX vs M27C1024-10XN3X feature comparison

AM27X1024-150PCXXXXX AMD

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M27C1024-10XN3X STMicroelectronics

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC STMICROELECTRONICS
Part Package Code DIP TSOP
Package Description DIP, 10 X 14 MM, PLASTIC, TSOP-40
Pin Count 40 40
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 20 ns 100 ns
JESD-30 Code R-PDIP-T40 R-PDSO-G40
Memory Density 65536 bit 1048576 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 16
Number of Functions 1 1
Number of Terminals 40 40
Number of Words 65536 words 65536 words
Number of Words Code 8000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -40 °C
Organization 8KX8 64KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Supply Current-Max 0.05 mA 0.035 mA
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL AUTOMOTIVE
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Number Matches 1 1
I/O Type COMMON
JESD-609 Code e0
Length 12.4 mm
Output Characteristics 3-STATE
Package Equivalence Code TSSOP40,.56,20
Seated Height-Max 1.2 mm
Standby Current-Max 0.0001 A
Terminal Finish TIN LEAD
Terminal Pitch 0.5 mm
Width 10 mm

Compare AM27X1024-150PCXXXXX with alternatives

Compare M27C1024-10XN3X with alternatives