AM27S33AFCB
vs
DM54S573BJ
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
DFP
|
DIP
|
| Package Description |
DFP, FL18,.3
|
DIP, DIP18,.3
|
| Pin Count |
18
|
18
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Access Time-Max |
150 ns
|
50 ns
|
| JESD-30 Code |
R-GDFP-F18
|
R-GDIP-T18
|
| JESD-609 Code |
e0
|
e0
|
| Memory Density |
4194304 bit
|
4096 bit
|
| Memory IC Type |
OTP ROM
|
OTP ROM
|
| Memory Width |
8
|
4
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
18
|
18
|
| Number of Words |
1024 words
|
1024 words
|
| Number of Words Code |
512000
|
1000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
75 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Organization |
512KX8
|
1KX4
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DFP
|
DIP
|
| Package Equivalence Code |
FL18,.3
|
DIP18,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
IN-LINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.286 mm
|
5.08 mm
|
| Supply Current-Max |
0.14 mA
|
0.14 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
FLAT
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
9.779 mm
|
7.62 mm
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
No
|
|
|
|
Compare AM27S33AFCB with alternatives
Compare DM54S573BJ with alternatives