AM27S33AFCB vs AM27S32AFCB feature comparison

AM27S33AFCB AMD

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AM27S32AFCB AMD

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC ADVANCED MICRO DEVICES INC
Part Package Code DFP DFP
Package Description DFP, FL18,.3 DFP, FL18,.3
Pin Count 18 18
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 150 ns 25 ns
JESD-30 Code R-GDFP-F18 R-CDFP-F18
JESD-609 Code e0 e0
Memory Density 4194304 bit 1048576 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 18 18
Number of Words 1024 words 1024 words
Number of Words Code 512000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 75 °C 75 °C
Operating Temperature-Min
Organization 512KX8 128KX8
Output Characteristics 3-STATE OPEN-COLLECTOR
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DFP DFP
Package Equivalence Code FL18,.3 FL18,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK FLATPACK
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.286 mm 2.286 mm
Supply Current-Max 0.14 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL EXTENDED COMMERCIAL EXTENDED
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form FLAT FLAT
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 9.779 mm 9.525 mm
Base Number Matches 1 1
Pbfree Code No
Length 9.779 mm

Compare AM27S33AFCB with alternatives

Compare AM27S32AFCB with alternatives