AM27S185A/BYC
vs
HM9-7685P8
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
HARRIS SEMICONDUCTOR
|
| Part Package Code |
DFP
|
|
| Package Description |
DFP, FL18,.3
|
DFP, FL18,.3
|
| Pin Count |
18
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Access Time-Max |
45 ns
|
90 ns
|
| JESD-30 Code |
R-GDFP-F18
|
R-XDFP-F18
|
| JESD-609 Code |
e0
|
e0
|
| Memory Density |
8192 bit
|
8192 bit
|
| Memory IC Type |
OTP ROM
|
OTP ROM
|
| Memory Width |
4
|
4
|
| Number of Functions |
1
|
|
| Number of Terminals |
18
|
18
|
| Number of Words |
2048 words
|
2048 words
|
| Number of Words Code |
2000
|
2000
|
| Operating Mode |
ASYNCHRONOUS
|
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
2KX4
|
2KX4
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC
|
| Package Code |
DFP
|
DFP
|
| Package Equivalence Code |
FL18,.3
|
FL18,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Parallel/Serial |
PARALLEL
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
38535Q/M;38534H;883B
|
MIL-STD-883 Class B (Modified)
|
| Supply Current-Max |
0.15 mA
|
0.17 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
TTL
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare AM27S185A/BYC with alternatives
Compare HM9-7685P8 with alternatives