AM27S12DC
vs
AM27S13PCB
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
ADVANCED MICRO DEVICES INC
Part Package Code
DIP
DIP
Package Description
DIP, DIP16,.3
DIP, DIP16,.3
Pin Count
16
16
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
150 ns
20 ns
JESD-30 Code
R-CDIP-T16
R-PDIP-T16
JESD-609 Code
e0
e0
Length
19.431 mm
19.05 mm
Memory Density
524288 bit
65536 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
16
16
Number of Words
512 words
512 words
Number of Words Code
64000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
75 °C
75 °C
Operating Temperature-Min
Organization
64KX8
8KX8
Output Characteristics
OPEN-COLLECTOR
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
BIPOLAR
BIPOLAR
Temperature Grade
COMMERCIAL EXTENDED
COMMERCIAL EXTENDED
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
1
Supply Current-Max
0.13 mA
Compare AM27S12DC with alternatives
Compare AM27S13PCB with alternatives