AM27S13PCB
vs
N82S231F
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
SIGNETICS CORP
Part Package Code
DIP
Package Description
DIP, DIP16,.3
,
Pin Count
16
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
20 ns
50 ns
JESD-30 Code
R-PDIP-T16
R-GDIP-T16
JESD-609 Code
e0
Length
19.05 mm
Memory Density
65536 bit
2048 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
8
4
Number of Functions
1
1
Number of Terminals
16
16
Number of Words
512 words
512 words
Number of Words Code
8000
512
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
75 °C
75 °C
Operating Temperature-Min
Organization
8KX8
512X4
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
Supply Current-Max
0.13 mA
Supply Voltage-Max (Vsup)
5.5 V
5.25 V
Supply Voltage-Min (Vsup)
4.5 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
BIPOLAR
BIPOLAR
Temperature Grade
COMMERCIAL EXTENDED
COMMERCIAL EXTENDED
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
1
3
Compare AM27S13PCB with alternatives
Compare N82S231F with alternatives