AM27C64-255DIB
vs
LH28F800SGHB-L10
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
SHARP CORP
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP, DIP28,.6
|
8 X 8 MM, FBGA-48
|
| Pin Count |
28
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.32.00.61
|
|
| Access Time-Max |
250 ns
|
100 ns
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
R-CDIP-T28
|
S-PBGA-B48
|
| JESD-609 Code |
e0
|
|
| Memory Density |
65536 bit
|
8388608 bit
|
| Memory IC Type |
UVPROM
|
FLASH
|
| Memory Width |
8
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
48
|
| Number of Words |
8192 words
|
524288 words
|
| Number of Words Code |
8000
|
512000
|
| Operating Mode |
ASYNCHRONOUS
|
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
8KX8
|
512KX16
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
TFBGA
|
| Package Equivalence Code |
DIP28,.6
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Parallel/Serial |
PARALLEL
|
|
| Programming Voltage |
12.75 V
|
3.3 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Standby Current-Max |
0.0001 A
|
|
| Supply Current-Max |
0.025 mA
|
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
BALL
|
| Terminal Pitch |
2.54 mm
|
0.8 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Base Number Matches |
4
|
1
|
| Length |
|
8 mm
|
| Seated Height-Max |
|
1.2 mm
|
| Type |
|
NOR TYPE
|
| Width |
|
8 mm
|
|
|
|
Compare AM27C64-255DIB with alternatives
Compare LH28F800SGHB-L10 with alternatives