AM27C64-255DIB vs AM2764ADC feature comparison

AM27C64-255DIB Rochester Electronics LLC

Buy Now Datasheet

AM2764ADC Rochester Electronics LLC

Buy Now Datasheet
Part Life Cycle Code Contact Manufacturer Contact Manufacturer
Ihs Manufacturer ROCHESTER ELECTRONICS LLC ROCHESTER ELECTRONICS LLC
Package Description WINDOWED, CERAMIC, DIP-28 DIP,
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 250 ns 250 ns
JESD-30 Code R-CDIP-T28 R-GDIP-T28
JESD-609 Code e0
Memory Density 65536 bit 65536 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 8KX8 8KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Supply Current-Max 0.025 mA
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 4.75 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS NMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 4 2
Length 37.1475 mm
Seated Height-Max 5.588 mm
Terminal Pitch 2.54 mm
Width 15.24 mm

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