TMS27PC256-100FML vs AM29F002NT-55PCB feature comparison

TMS27PC256-100FML Texas Instruments

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AM29F002NT-55PCB Spansion

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC SPANSION INC
Package Description QCCJ, LDCC32,.5X.6 ,
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.51
Access Time-Max 100 ns
I/O Type COMMON
JESD-30 Code R-PQCC-J32 R-PDIP-T32
Length 13.97 mm
Memory Density 262144 bit
Memory IC Type OTP ROM FLASH
Memory Width 8
Number of Functions 1
Number of Terminals 32 32
Number of Words 32768 words
Number of Words Code 32000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 32KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ
Package Equivalence Code LDCC32,.5X.6
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER IN-LINE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 13 V 5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.56 mm
Standby Current-Max 0.00025 A
Supply Current-Max 0.03 mA
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL
Terminal Form J BEND THROUGH-HOLE
Terminal Pitch 1.27 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 11.43 mm
Base Number Matches 1 1
Part Package Code DIP
Pin Count 32
Additional Feature TOP BOOT BLOCK
Boot Block TOP
Type NOR TYPE

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Compare AM29F002NT-55PCB with alternatives