AM27C512-150PC
vs
M27C512-20XB3X
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
STMICROELECTRONICS
Part Package Code
DIP
DIP
Package Description
PLASTIC, DIP-28
0.600 INCH, PLASTIC, DIP-28
Pin Count
28
28
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
150 ns
150 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-PDIP-T28
R-PDIP-T28
JESD-609 Code
e0
Length
37.084 mm
37.085 mm
Memory Density
524288 bit
524288 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-40 °C
Organization
64KX8
64KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP28,.6
DIP28,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.715 mm
5.08 mm
Standby Current-Max
0.0001 A
0.0001 A
Supply Current-Max
0.025 mA
0.03 mA
Supply Voltage-Max (Vsup)
5.5 V
5.25 V
Supply Voltage-Min (Vsup)
4.5 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
AUTOMOTIVE
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
Base Number Matches
3
1
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare AM27C512-150PC with alternatives
Compare M27C512-20XB3X with alternatives