M27C512-20XB3X
vs
AM27C512-150DCB
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
ADVANCED MICRO DEVICES INC
Part Package Code
DIP
DIP
Package Description
0.600 INCH, PLASTIC, DIP-28
WDIP, DIP28,.6
Pin Count
28
28
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.61
Access Time-Max
150 ns
150 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-PDIP-T28
R-CDIP-T28
Length
37.085 mm
37.1475 mm
Memory Density
524288 bit
524288 bit
Memory IC Type
OTP ROM
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
64KX8
64KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
WDIP
Package Equivalence Code
DIP28,.6
DIP28,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE, WINDOW
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
5.588 mm
Standby Current-Max
0.0001 A
0.0001 A
Supply Current-Max
0.03 mA
0.025 mA
Supply Voltage-Max (Vsup)
5.25 V
5.5 V
Supply Voltage-Min (Vsup)
4.75 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
15.24 mm
15.24 mm
Base Number Matches
1
4
JESD-609 Code
e0
Terminal Finish
TIN LEAD
Compare M27C512-20XB3X with alternatives
Compare AM27C512-150DCB with alternatives