AM27C49-35TDCB vs MCM68764C-35 feature comparison

AM27C49-35TDCB AMD

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MCM68764C-35 Motorola Mobility LLC

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC MOTOROLA INC
Part Package Code DIP DIP
Package Description WINDOWED, CERAMIC, DIP-24 WDIP,
Pin Count 24 24
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 35 ns 350 ns
JESD-30 Code R-GDIP-T24 R-GDIP-T24
Length 32.0675 mm 32.005 mm
Memory Density 65536 bit 65536 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 75 °C 70 °C
Operating Temperature-Min
Organization 8KX8 8KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code WDIP WDIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE, WINDOW IN-LINE, WINDOW
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.588 mm 5.84 mm
Supply Current-Max 0.09 mA 0.085 mA
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS NMOS
Temperature Grade COMMERCIAL EXTENDED COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 15.24 mm 15.24 mm
Base Number Matches 1 1
JESD-609 Code e0
Terminal Finish Tin/Lead (Sn/Pb)

Compare AM27C49-35TDCB with alternatives

Compare MCM68764C-35 with alternatives