MCM68764C-35 vs 5962-8751512LA feature comparison

MCM68764C-35 Motorola Mobility LLC

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5962-8751512LA Cypress Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC CYPRESS SEMICONDUCTOR CORP
Part Package Code DIP DIP
Package Description WDIP, 0.300 INCH, WINDOWED, CERDIP-24
Pin Count 24 24
Reach Compliance Code unknown unknown
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 350 ns 25 ns
JESD-30 Code R-GDIP-T24 R-GDIP-T24
JESD-609 Code e0 e0
Length 32.005 mm 31.877 mm
Memory Density 65536 bit 65536 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 8KX8 8KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code WDIP WDIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE, WINDOW IN-LINE, WINDOW
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.84 mm 5.08 mm
Supply Current-Max 0.085 mA 0.14 mA
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology NMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15.24 mm 7.62 mm
Base Number Matches 2 4
Additional Feature POWER SWITCHED PROM
I/O Type COMMON
Package Equivalence Code DIP24,.3
Screening Level 38535Q/M;38534H;883B
Standby Current-Max 0.05 A

Compare MCM68764C-35 with alternatives

Compare 5962-8751512LA with alternatives