AM27C256-70DCB
vs
CY27C256A-70WC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Contact Manufacturer
Ihs Manufacturer
SPANSION INC
ROCHESTER ELECTRONICS LLC
Part Package Code
DIP
DIP
Package Description
DIP,
0.600 INCH, HERMETIC SEALED, WINDOWED, CERDIP-28
Pin Count
28
28
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.61
8542.32.00.61
Access Time-Max
70 ns
70 ns
JESD-30 Code
R-CDIP-T28
R-GDIP-T28
Length
37.1475 mm
37.338 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
UVPROM
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
32KX8
32KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, GLASS-SEALED
Package Code
DIP
WDIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE, WINDOW
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.588 mm
5.715 mm
Supply Current-Max
0.025 mA
0.045 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
Base Number Matches
1
1
Compare AM27C256-70DCB with alternatives
Compare CY27C256A-70WC with alternatives