Memory
AM27C256-70DCB
Description: UVPROM, 32KX8, 70ns, CMOS, CDIP28, DIP-28

Overview of AM27C256-70DCB by Spansion

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Computing and Data Storage Financial Technology (Fintech) Telecommunications

Available Datasheets

Part # Manufacturer Description Datasheet
AM27C256-55DM/B Rochester Electronics AM27C256 - 256K (32KX8) CMOS EPROM
AM27C256-120PC-G Rochester Electronics AM27C256 - 256Kb (32K x 8-Bit) CMOS OTP EPROM
AM27C256-150DI Rochester Electronics LLC Replacement for AMD part number AM27C256-150DI. Buy from authorized manufacturer Rochester Electronics.

CAD Models for AM27C256-70DCB by Spansion
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Part Data Attributes for AM27C256-70DCB by Spansion

AM27C256-70DCB
Spansion
-
-
Part Life Cycle Code
Obsolete
Ihs Manufacturer
SPANSION INC
Part Package Code
DIP
Package Description
DIP,
Pin Count
28
Reach Compliance Code
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.61
Access Time-Max
70 ns
JESD-30 Code
R-CDIP-T28
Length
37.1475 mm
Memory Density
262144 bit
Memory IC Type
UVPROM
Memory Width
8
Number of Functions
1
Number of Terminals
28
Number of Words
32768 words
Number of Words Code
32000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
32KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
5.588 mm
Supply Current-Max
0.025 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
15.24 mm
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  1. AM27C256-70DCB
    Spansion
    UVPROM, 32KX8, 70ns, CMOS, CDIP28, DIP-28
    VS

Alternate Parts for AM27C256-70DCB

This table gives cross-reference parts and alternative options found for AM27C256-70DCB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27C256-70DCB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
AT27HC256RL-70DC UVPROM, 32KX8, 70ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Atmel Corporation AM27C256-70DCB vs AT27HC256RL-70DC
AM27C256-70DEB UVPROM, 32KX8, 70ns, CMOS, CDIP28, DIP-28 Spansion AM27C256-70DCB vs AM27C256-70DEB
5962-8606308XC UVPROM, 32KX8, 70ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Atmel Corporation AM27C256-70DCB vs 5962-8606308XC
AT27HC256R-70DM/883 UVPROM, 32KX8, 70ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Atmel Corporation AM27C256-70DCB vs AT27HC256R-70DM/883
AM27C256-70DIB UVPROM, 32KX8, 70ns, CMOS, CDIP28, DIP-28 Spansion AM27C256-70DCB vs AM27C256-70DIB
5962-8606308XX UVPROM, 32KX8, 70ns, CMOS, CDIP28 QP Semiconductor AM27C256-70DCB vs 5962-8606308XX
CY27C256A-70WC UVPROM, 32KX8, 70ns, CMOS, CDIP28, 0.600 INCH, HERMETIC SEALED, WINDOWED, CERDIP-28 Rochester Electronics LLC AM27C256-70DCB vs CY27C256A-70WC
5962-8606308XA 32KX8 UVPROM, 70ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 STMicroelectronics AM27C256-70DCB vs 5962-8606308XA
27HC256L-70/J 32K X 8 UVPROM, 70 ns, CDIP28, 0.600 INCH, CERDIP-28 Microchip Technology Inc AM27C256-70DCB vs 27HC256L-70/J
AM27C256-70DE UVPROM, 32KX8, 70ns, CMOS, CDIP28, DIP-28 Spansion AM27C256-70DCB vs AM27C256-70DE
Part Number Description Manufacturer Compare
27HC256L-70/J 32K X 8 UVPROM, 70 ns, CDIP28, 0.600 INCH, CERDIP-28 Microchip Technology Inc AM27C256-70DCB vs 27HC256L-70/J
AS27C256-70JM UVPROM, 32KX8, 70ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Micross Components AM27C256-70DCB vs AS27C256-70JM
AT27HC256RL-70DC UVPROM, 32KX8, 70ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Atmel Corporation AM27C256-70DCB vs AT27HC256RL-70DC
AM27C256-70DEB UVPROM, 32KX8, 70ns, CMOS, CDIP28, DIP-28 Spansion AM27C256-70DCB vs AM27C256-70DEB
CY27C256A-70WC UVPROM, 32KX8, 70ns, CMOS, CDIP28, 0.600 INCH, HERMETIC SEALED, WINDOWED, CERDIP-28 Cypress Semiconductor AM27C256-70DCB vs CY27C256A-70WC
M27C256B-70XF6X 32KX8 UVPROM, 70ns, CDIP28, FRIT SEALED, WINDOWED, CERAMIC, DIP-28 STMicroelectronics AM27C256-70DCB vs M27C256B-70XF6X
MSM27C256H-70AS UVPROM, 32KX8, 70ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 OKI Electric Industry Co Ltd AM27C256-70DCB vs MSM27C256H-70AS
M27C256BF 32KX8 UVPROM, 70ns, CDIP28, FRIT SEALED, WINDOWED, CERAMIC, DIP-28 STMicroelectronics AM27C256-70DCB vs M27C256BF
AT27HC256R-70DM/883 UVPROM, 32KX8, 70ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Atmel Corporation AM27C256-70DCB vs AT27HC256R-70DM/883
M27C256B-70F1X 32KX8 UVPROM, 70ns, CDIP28, FRIT SEALED, WINDOWED, CERAMIC, DIP-28 STMicroelectronics AM27C256-70DCB vs M27C256B-70F1X

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