Part Details for AM27C256-70DCB by Spansion
Overview of AM27C256-70DCB by Spansion
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (6 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| AM27C256-55DM/B | Rochester Electronics | AM27C256 - 256K (32KX8) CMOS EPROM | |
| AM27C256-120PC-G | Rochester Electronics | AM27C256 - 256Kb (32K x 8-Bit) CMOS OTP EPROM | |
| AM27C256-150DI | Rochester Electronics LLC | Replacement for AMD part number AM27C256-150DI. Buy from authorized manufacturer Rochester Electronics. |
Part Details for AM27C256-70DCB
AM27C256-70DCB CAD Models
AM27C256-70DCB Part Data Attributes
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AM27C256-70DCB
Spansion
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Datasheet
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AM27C256-70DCB
Spansion
UVPROM, 32KX8, 70ns, CMOS, CDIP28, DIP-28
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SPANSION INC | |
| Part Package Code | DIP | |
| Package Description | DIP, | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 70 ns | |
| JESD-30 Code | R-CDIP-T28 | |
| Length | 37.1475 mm | |
| Memory Density | 262144 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 32KX8 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.588 mm | |
| Supply Current-Max | 0.025 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for AM27C256-70DCB
This table gives cross-reference parts and alternative options found for AM27C256-70DCB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27C256-70DCB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| 5962-8606308XA | Waferscale Integration Inc | Check for Price | UVPROM, 32KX8, 70ns, CMOS, CDIP28, CERAMIC, DIP-28 | AM27C256-70DCB vs 5962-8606308XA |
| AM27C256-70DI | Spansion | Check for Price | UVPROM, 32KX8, 70ns, CMOS, CDIP28, DIP-28 | AM27C256-70DCB vs AM27C256-70DI |
| M27C256B-70F7X | STMicroelectronics | Check for Price | 32KX8 UVPROM, 70ns, CDIP28, FRIT SEALED, WINDOWED, CERAMIC, DIP-28 | AM27C256-70DCB vs M27C256B-70F7X |
| 5962-8606308XA | Teledyne e2v | Check for Price | UVPROM, 32KX8, 70ns, CMOS, CDIP28, | AM27C256-70DCB vs 5962-8606308XA |
| 5962-8606308XA | QP Semiconductor | Check for Price | UVPROM, 32KX8, 70ns, CMOS, CDIP28 | AM27C256-70DCB vs 5962-8606308XA |
| MSM27C256H-70AS | OKI Electric Industry Co Ltd | Check for Price | UVPROM, 32KX8, 70ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | AM27C256-70DCB vs MSM27C256H-70AS |