AM27C256-175LCB
vs
AS27C256-17ECAI
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
MICROSS COMPONENTS
|
Part Package Code |
QFJ
|
QFJ
|
Package Description |
WQCCN,
|
0.450 X 0.550 INCH, CERAMIC, LCC-32
|
Pin Count |
32
|
32
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.61
|
8542.32.00.61
|
Access Time-Max |
170 ns
|
170 ns
|
JESD-30 Code |
R-CQCC-N32
|
R-CQCC-N32
|
Length |
13.97 mm
|
13.97 mm
|
Memory Density |
262144 bit
|
262144 bit
|
Memory IC Type |
UVPROM
|
UVPROM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
32
|
32
|
Number of Words |
32768 words
|
32768 words
|
Number of Words Code |
32000
|
32000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
32KX8
|
32KX8
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
WQCCN
|
QCCN
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, WINDOW
|
CHIP CARRIER
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.556 mm
|
3.048 mm
|
Supply Current-Max |
0.05 mA
|
0.025 mA
|
Supply Voltage-Max (Vsup) |
5.25 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.75 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
11.43 mm
|
11.43 mm
|
Base Number Matches |
1
|
1
|
I/O Type |
|
COMMON
|
JESD-609 Code |
|
e4
|
Package Equivalence Code |
|
LCC32,.45X.55
|
Programming Voltage |
|
12.5 V
|
Standby Current-Max |
|
0.0003 A
|
Terminal Finish |
|
PALLADIUM GOLD
|
|
|
|
Compare AM27C256-175LCB with alternatives
Compare AS27C256-17ECAI with alternatives