AM27C1024LEB vs M27C1024-10F6X feature comparison

AM27C1024LEB AMD

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M27C1024-10F6X STMicroelectronics

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC STMICROELECTRONICS
Part Package Code LCC DIP
Package Description QCCN, LCC44,.65SQ WINDOWED, FRIT SEALED, CERAMIC, DIP-40
Pin Count 44 40
Reach Compliance Code unknown compliant
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 250 ns 100 ns
I/O Type COMMON COMMON
JESD-30 Code S-CQCC-N44 R-GDIP-T40
JESD-609 Code e0 e3
Length 16.51 mm 52.195 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type UVPROM UVPROM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 44 40
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 64KX16 64KX16
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code QCCN WDIP
Package Equivalence Code LCC44,.65SQ DIP40,.6
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER IN-LINE, WINDOW
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.54 mm 5.97 mm
Supply Current-Max 0.06 mA 0.035 mA
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form NO LEAD THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position QUAD DUAL
Width 16.51 mm 15.24 mm
Base Number Matches 1 1
Standby Current-Max 0.0001 A

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