AM27C1024-255DIB
vs
AM27C1024-255DI
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
SPANSION INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
DIP
Package Description
DIP,
Pin Count
40
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.61
Access Time-Max
250 ns
JESD-30 Code
R-CDIP-T40
Length
52.26 mm
Memory Density
1048576 bit
Memory IC Type
UVPROM
Memory Width
16
Number of Functions
1
Number of Terminals
40
Number of Words
65536 words
Number of Words Code
64000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
64KX16
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
5.588 mm
Supply Current-Max
0.05 mA
Supply Voltage-Max (Vsup)
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
15.24 mm
Base Number Matches
3
3
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