AM27C1024-255DIB
vs
AM27C1024-250DEB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
ADVANCED MICRO DEVICES INC
Reach Compliance Code
compliant
unknown
Base Number Matches
3
1
Rohs Code
Part Package Code
DIP
Package Description
WDIP, DIP40,.6
Pin Count
40
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.61
Access Time-Max
250 ns
I/O Type
COMMON
JESD-30 Code
R-GDIP-T40
JESD-609 Code
e0
Length
52.2605 mm
Memory Density
1048576 bit
Memory IC Type
UVPROM
Memory Width
16
Number of Functions
1
Number of Terminals
40
Number of Words
65536 words
Number of Words Code
64000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
64KX16
Output Characteristics
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
Package Code
WDIP
Package Equivalence Code
DIP40,.6
Package Shape
RECTANGULAR
Package Style
IN-LINE, WINDOW
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
5.588 mm
Standby Current-Max
0.00024 A
Supply Current-Max
0.06 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
15.24 mm
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