AM27C020-255DE
vs
M27C2001-25XF6TR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
STMICROELECTRONICS
Part Package Code
DIP
DIP
Package Description
WDIP, DIP32,.6
LEAD FREE, WINDOWED, FRIT SEALED, CERAMIC, DIP-32
Pin Count
32
32
Reach Compliance Code
unknown
compliant
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.61
8542.32.00.61
Access Time-Max
250 ns
250 ns
I/O Type
COMMON
JESD-30 Code
R-GDIP-T32
R-CDIP-T32
JESD-609 Code
e0
e3
Length
42.1005 mm
41.885 mm
Memory Density
2097152 bit
2097152 bit
Memory IC Type
UVPROM
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
256KX8
256KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
WDIP
WDIP
Package Equivalence Code
DIP32,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE, WINDOW
IN-LINE, WINDOW
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.588 mm
5.72 mm
Standby Current-Max
0.0001 A
Supply Current-Max
0.06 mA
0.03 mA
Supply Voltage-Max (Vsup)
5.25 V
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
Base Number Matches
1
1
Compare AM27C020-255DE with alternatives
Compare M27C2001-25XF6TR with alternatives