AM26LS33MF vs AM26LS33MN feature comparison

AM26LS33MF Philips Semiconductors

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AM26LS33MN YAGEO Corporation

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Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer PHILIPS SEMICONDUCTORS PHILIPS COMPONENTS
Package Description DIP, DIP16,.3 ,
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Interface IC Type LINE RECEIVER LINE RECEIVER
JESD-30 Code R-XDIP-T16 R-PDIP-T16
JESD-609 Code e0
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Low Current-Max 0.008 A
Package Body Material CERAMIC PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Receive Delay-Max 25 ns 25 ns
Supply Current-Max 70 mA 70 mA
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology TTL BIPOLAR
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 3 3
Input Characteristics DIFFERENTIAL SCHMITT TRIGGER
Interface Standard GENERAL PURPOSE
Number of Functions 4
Output Characteristics 3-STATE
Output Polarity INVERTED
Receiver Number of Bits 4
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V

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