AM26LS32BCN vs AM26LS32BDC feature comparison

AM26LS32BCN Philips Semiconductors

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AM26LS32BDC Rochester Electronics LLC

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Rohs Code No
Part Life Cycle Code Transferred Active
Ihs Manufacturer PHILIPS SEMICONDUCTORS ROCHESTER ELECTRONICS LLC
Package Description DIP, DIP16,.3 DIP,
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Interface IC Type LINE RECEIVER LINE RECEIVER
JESD-30 Code R-PDIP-T16 R-GDIP-T16
JESD-609 Code e0
Number of Terminals 16 16
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Low Current-Max 0.024 A
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified
Receive Delay-Max 26 ns 26 ns
Supply Current-Max 70 mA
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology TTL BIPOLAR
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 3 2
Input Characteristics DIFFERENTIAL SCHMITT TRIGGER
Interface Standard V.10; V.11; EIA-422; EIA-423; FED STD 1020; FED STD 1030
Length 19.431 mm
Number of Functions 4
Peak Reflow Temperature (Cel) NOT SPECIFIED
Receiver Number of Bits 4
Seated Height-Max 5.08 mm
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm

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