AM26LS32B/BFA vs AM26LS32/BEA feature comparison

AM26LS32B/BFA AMD

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AM26LS32/BEA Philips Semiconductors

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC PHILIPS SEMICONDUCTORS
Part Package Code DFP
Package Description DFP, FL16,.3 DIP-16
Pin Count 16
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Input Characteristics DIFFERENTIAL SCHMITT TRIGGER
Interface IC Type LINE RECEIVER LINE RECEIVER
Interface Standard V.10; V.11; EIA-422; EIA-423; FED STD 1020; FED STD 1030
JESD-30 Code R-GDFP-F16 R-XDIP-T16
JESD-609 Code e0 e0
Length 10.16 mm
Number of Functions 4
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Characteristics 3-STATE
Output Low Current-Max 0.024 A 0.008 A
Output Polarity TRUE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC
Package Code DFP DIP
Package Equivalence Code FL16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK IN-LINE
Qualification Status Not Qualified Not Qualified
Receive Delay-Max 26 ns 38 ns
Receiver Number of Bits 4
Screening Level 38535Q/M;38534H;883B 38535Q/M;38534H;883B
Seated Height-Max 2.159 mm
Supply Current-Max 70 mA 70 mA
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology BIPOLAR TTL
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form FLAT THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 6.731 mm
Base Number Matches 2 3

Compare AM26LS32B/BFA with alternatives

Compare AM26LS32/BEA with alternatives