AM26LS31MF
vs
DS26LS31MJ-QMLV
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
TEXAS INSTRUMENTS INC
Part Package Code
DIP
DIP
Package Description
DIP,
DIP, DIP16,.3
Pin Count
16
16
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Differential Output
YES
YES
Driver Number of Bits
4
4
Input Characteristics
STANDARD
STANDARD
Interface IC Type
LINE DRIVER
LINE DRIVER
Interface Standard
EIA-422; FED STD 1020
EIA-422; FED STD 1020
JESD-30 Code
R-GDIP-T16
R-GDIP-T16
Length
19.535 mm
19.94 mm
Number of Functions
4
4
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
COMPLEMENTARY
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
5.08 mm
Supply Current-Max
80 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
BIPOLAR
BIPOLAR
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Transmit Delay-Max
20 ns
30 ns
Width
7.62 mm
7.62 mm
Base Number Matches
3
2
Rohs Code
Additional Feature
LG_MAX; SEATED HGT-NOM
High Level Input Current-Max
0.00002 A
Moisture Sensitivity Level
1
Out Swing-Min
2 V
Receive Delay-Max
Screening Level
MIL-PRF-38535 Class V
Compare AM26LS31MF with alternatives
Compare DS26LS31MJ-QMLV with alternatives