AM26LS31DM vs DS96F174MMD8 feature comparison

AM26LS31DM AMD

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DS96F174MMD8 Texas Instruments

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP DIE
Package Description DIP, DIP16,.3 DIE, DIE OR CHIP
Pin Count 16
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Differential Output YES YES
Driver Number of Bits 4 4
High Level Input Current-Max 0.00002 A 0.00002 A
Input Characteristics STANDARD STANDARD
Interface IC Type LINE DRIVER LINE DRIVER
Interface Standard EIA-422; FED STD 1020 EIA-422; EIA-485
JESD-30 Code R-CDIP-T16 X-XUUC-N
JESD-609 Code e0
Length 19.431 mm
Number of Functions 4 4
Number of Terminals 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Out Swing-Min 2 V 1.5 V
Output Characteristics 3-STATE 3-STATE
Output Polarity COMPLEMENTARY
Package Body Material CERAMIC, METAL-SEALED COFIRED UNSPECIFIED
Package Code DIP DIE
Package Equivalence Code DIP16,.3 DIE OR CHIP
Package Shape RECTANGULAR UNSPECIFIED
Package Style IN-LINE UNCASED CHIP
Qualification Status Not Qualified Not Qualified
Receive Delay-Max
Screening Level MIL-STD-883 Class C 38535Q/M;38534H;883B
Seated Height-Max 5.08 mm
Supply Voltage-Nom 5 V 5 V
Surface Mount NO YES
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm
Terminal Position DUAL UPPER
Transmit Delay-Max 30 ns 25 ns
Width 7.62 mm
Base Number Matches 4 1
Pbfree Code Yes
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
Time@Peak Reflow Temperature-Max (s) 40

Compare AM26LS31DM with alternatives

Compare DS96F174MMD8 with alternatives