AM26C31QDBR
vs
5962-7802001MFA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
TEXAS INSTRUMENTS INC
PHILIPS SEMICONDUCTORS
Part Package Code
SOIC
Package Description
SSOP, SSOP16,.3
Pin Count
16
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Differential Output
YES
Driver Number of Bits
4
High Level Input Current-Max
0.000001 A
Input Characteristics
STANDARD
Interface IC Type
LINE DRIVER
LINE RECEIVER
Interface Standard
EIA-422-B; TIA-422-B; V.11
JESD-30 Code
R-PDSO-G16
R-XDFP-F16
Length
6.2 mm
Number of Functions
4
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Out Swing-Min
2 V
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
CERAMIC
Package Code
SSOP
DFP
Package Equivalence Code
SSOP16,.3
FL16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
FLATPACK
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2 mm
Supply Voltage-Max
5.5 V
Supply Voltage-Min
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
BICMOS
TTL
Temperature Grade
AUTOMOTIVE
MILITARY
Terminal Form
GULL WING
FLAT
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Transmit Delay-Max
12 ns
Width
5.3 mm
Base Number Matches
1
9
Rohs Code
JESD-609 Code
e0
Output Low Current-Max
0.008 A
Receive Delay-Max
38 ns
Screening Level
38535Q/M;38534H;883B
Supply Current-Max
70 mA
Terminal Finish
Tin/Lead (Sn/Pb) - hot dipped
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