AM26C31IDBR
vs
DS90C032MWC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
NATIONAL SEMICONDUCTOR CORP
Part Package Code
SOIC
Package Description
SSOP-16
DIE, WAFER
Pin Count
16
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Texas Instruments
Differential Output
YES
Driver Number of Bits
4
High Level Input Current-Max
0.000001 A
Input Characteristics
STANDARD
DIFFERENTIAL
Interface IC Type
LINE DRIVER
LINE RECEIVER
Interface Standard
EIA-422-B; TIA-422-B; V.11
EIA-644; TIA-644
JESD-30 Code
R-PDSO-G16
X-XUUC-N
JESD-609 Code
e4
Length
6.2 mm
Moisture Sensitivity Level
1
1
Number of Functions
4
4
Number of Terminals
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Out Swing-Min
2 V
Output Characteristics
3-STATE
Output Low Current-Max
0.02 A
0.002 A
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
SSOP
DIE
Package Equivalence Code
SSOP16,.3
WAFER
Package Shape
RECTANGULAR
UNSPECIFIED
Package Style
SMALL OUTLINE, SHRINK PITCH
UNCASED CHIP
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2 mm
Supply Current-Max
3 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Supply Voltage1-Max
5.5 V
Supply Voltage1-Min
4.5 V
Supply Voltage1-Nom
5 V
Surface Mount
YES
YES
Technology
BICMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.65 mm
Terminal Position
DUAL
UPPER
Time@Peak Reflow Temperature-Max (s)
30
40
Transmit Delay-Max
12 ns
Width
5.3 mm
Base Number Matches
1
2
Receive Delay-Max
5 ns
Receiver Number of Bits
4
Compare AM26C31IDBR with alternatives
Compare DS90C032MWC with alternatives