AM25LS2539PC vs N74F537N feature comparison

AM25LS2539PC AMD

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N74F537N NXP Semiconductors

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC NXP SEMICONDUCTORS
Part Package Code DIP DIP
Package Description DIP, DIP20,.3 0.300 INCH, PLASTIC, DIP-20
Pin Count 20 20
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family LS F/FAST
Input Conditioning STANDARD STANDARD
JESD-30 Code R-PDIP-T20 R-PDIP-T20
JESD-609 Code e0
Length 26.289 mm 26.695 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type 2-LINE TO 4-LINE DECODER DECIMAL DECODER/DRIVER
Number of Functions 2 1
Number of Terminals 20 20
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Characteristics 3-STATE 3-STATE
Output Polarity CONFIGURABLE CONFIGURABLE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP20,.3 DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supply Current-Max (ICC) 37 mA 66 mA
Propagation Delay (tpd) 34 ns 12 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 4.06 mm
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 2 3
Additional Feature 2 ENABLE INPUTS
Max I(ol) 0.024 A
Moisture Sensitivity Level 1
Prop. Delay@Nom-Sup 17 ns

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Compare N74F537N with alternatives