AM25LS2539PC
vs
HD74AC538P
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
HITACHI LTD
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP, DIP20,.3
|
DIP, DIP20,.3
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
LS
|
AC
|
| Input Conditioning |
STANDARD
|
|
| JESD-30 Code |
R-PDIP-T20
|
R-PDIP-T20
|
| JESD-609 Code |
e0
|
e0
|
| Length |
26.289 mm
|
24.5 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
2-LINE TO 4-LINE DECODER
|
OTHER DECODER/DRIVER
|
| Number of Functions |
2
|
1
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
CONFIGURABLE
|
CONFIGURABLE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP20,.3
|
DIP20,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Power Supply Current-Max (ICC) |
37 mA
|
|
| Propagation Delay (tpd) |
34 ns
|
20 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
5.08 mm
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
TTL
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
2
|
2
|
| Prop. Delay@Nom-Sup |
|
20 ns
|
|
|
|
Compare AM25LS2539PC with alternatives
Compare HD74AC538P with alternatives