AM2147-35DM vs MBM10470A-10CZ feature comparison

AM2147-35DM AMD

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MBM10470A-10CZ FUJITSU Limited

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC FUJITSU SEMICONDUCTOR AMERICA INC
Package Description DIP, DIP18,.3 DIP,
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 35 ns 10 ns
I/O Type SEPARATE
JESD-30 Code R-XDIP-T18 R-GDIP-T18
JESD-609 Code e0
Memory Density 4096 bit 4096 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 1 1
Number of Terminals 18 18
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 75 °C
Operating Temperature-Min -55 °C
Organization 4KX1 4KX1
Output Characteristics 3-STATE OPEN-EMITTER
Package Body Material CERAMIC CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP18,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 Class C
Standby Voltage-Min 4.5 V
Supply Current-Max 0.18 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO NO
Technology MOS TTL
Temperature Grade MILITARY COMMERCIAL EXTENDED
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 2 2
Part Package Code DIP
Pin Count 18
Length 22.78 mm
Number of Functions 1
Number of Ports 1
Output Enable NO
Seated Height-Max 5.08 mm
Width 7.62 mm

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Compare MBM10470A-10CZ with alternatives