AM2147-35DM
vs
MBM10470A-10CZ
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
FUJITSU SEMICONDUCTOR AMERICA INC
Package Description
DIP, DIP18,.3
DIP,
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
35 ns
10 ns
I/O Type
SEPARATE
JESD-30 Code
R-XDIP-T18
R-GDIP-T18
JESD-609 Code
e0
Memory Density
4096 bit
4096 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
1
1
Number of Terminals
18
18
Number of Words
4096 words
4096 words
Number of Words Code
4000
4000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
75 °C
Operating Temperature-Min
-55 °C
Organization
4KX1
4KX1
Output Characteristics
3-STATE
OPEN-EMITTER
Package Body Material
CERAMIC
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP18,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883 Class C
Standby Voltage-Min
4.5 V
Supply Current-Max
0.18 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
NO
Technology
MOS
TTL
Temperature Grade
MILITARY
COMMERCIAL EXTENDED
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
2
2
Part Package Code
DIP
Pin Count
18
Length
22.78 mm
Number of Functions
1
Number of Ports
1
Output Enable
NO
Seated Height-Max
5.08 mm
Width
7.62 mm
Compare AM2147-35DM with alternatives
Compare MBM10470A-10CZ with alternatives