AM10470ADC
vs
HM4-65262-2:R
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
ATMEL CORP
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP, DIP18,.3
|
,
|
| Pin Count |
18
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
25 ns
|
|
| I/O Type |
SEPARATE
|
|
| JESD-30 Code |
R-GDIP-T18
|
|
| JESD-609 Code |
e0
|
|
| Length |
22.86 mm
|
|
| Memory Density |
4096 bit
|
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
1
|
|
| Number of Functions |
1
|
|
| Number of Ports |
1
|
|
| Number of Terminals |
18
|
|
| Number of Words |
4096 words
|
|
| Number of Words Code |
4000
|
|
| Operating Mode |
ASYNCHRONOUS
|
|
| Operating Temperature-Max |
75 °C
|
|
| Operating Temperature-Min |
|
|
| Organization |
4KX1
|
|
| Output Characteristics |
OPEN-EMITTER
|
|
| Output Enable |
NO
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
|
| Package Code |
DIP
|
|
| Package Equivalence Code |
DIP18,.3
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
IN-LINE
|
|
| Parallel/Serial |
PARALLEL
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
|
| Supply Current-Max |
0.2 mA
|
|
| Surface Mount |
NO
|
|
| Technology |
ECL
|
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
|
| Width |
7.62 mm
|
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare AM10470ADC with alternatives
Compare HM4-65262-2:R with alternatives