AGLP030V2-CSG289
vs
AGLP030V2-CS289
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MICROSEMI SOC PRODUCTS GROUP
|
MICROSEMI SOC PRODUCTS GROUP
|
Part Package Code |
BGA
|
BGA
|
Package Description |
TFBGA, BGA289,17X17,32
|
TFBGA, BGA289,17X17,32
|
Pin Count |
289
|
289
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Clock Frequency-Max |
160 MHz
|
160 MHz
|
JESD-30 Code |
S-PBGA-B289
|
S-PBGA-B289
|
Length |
14 mm
|
14 mm
|
Moisture Sensitivity Level |
3
|
|
Number of CLBs |
792
|
792
|
Number of Equivalent Gates |
30000
|
30000
|
Number of Inputs |
120
|
120
|
Number of Logic Cells |
792
|
792
|
Number of Outputs |
120
|
120
|
Number of Terminals |
289
|
289
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
792 CLBS, 30000 GATES
|
792 CLBS, 30000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFBGA
|
TFBGA
|
Package Equivalence Code |
BGA289,17X17,32
|
BGA289,17X17,32
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Supply Voltage-Max |
1.575 V
|
1.575 V
|
Supply Voltage-Min |
1.425 V
|
1.425 V
|
Supply Voltage-Nom |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Width |
14 mm
|
14 mm
|
Base Number Matches |
4
|
4
|
|
|
|
Compare AGLP030V2-CSG289 with alternatives
Compare AGLP030V2-CS289 with alternatives