AGLN015V2-QNG68I vs M1AGL1000V2-FGG144 feature comparison

AGLN015V2-QNG68I Microchip Technology Inc

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M1AGL1000V2-FGG144 Microchip Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Package Description 8 X 8 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-68 13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, FBGA-144
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 8 Weeks 12 Weeks
JESD-30 Code S-XQCC-N68 S-PBGA-B144
Length 8 mm 13 mm
Moisture Sensitivity Level 3 3
Number of CLBs 384
Number of Equivalent Gates 15000 1000000
Number of Terminals 68 144
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C
Organization 384 CLBS, 15000 GATES 1000000 GATES
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code HVQCCN LBGA
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE GRID ARRAY, LOW PROFILE
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 1.55 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Form NO LEAD BALL
Terminal Pitch 0.4 mm 1 mm
Terminal Position QUAD BOTTOM
Width 8 mm 13 mm
Base Number Matches 1 4
JESD-609 Code e1
Number of Inputs 97
Number of Logic Cells 24576
Number of Outputs 97
Package Equivalence Code BGA144,12X12,40
Peak Reflow Temperature (Cel) 260
Terminal Finish TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s) 30

Compare AGLN015V2-QNG68I with alternatives

Compare M1AGL1000V2-FGG144 with alternatives