AGLN015V2-QNG68I
vs
M1AGL250V2-FG144YI
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI SOC PRODUCTS GROUP
|
| Package Description |
8 X 8 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-68
|
,
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
8 Weeks
|
|
| JESD-30 Code |
S-XQCC-N68
|
S-PBGA-B144
|
| Length |
8 mm
|
13 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
384
|
|
| Number of Equivalent Gates |
15000
|
250000
|
| Number of Terminals |
68
|
144
|
| Operating Temperature-Max |
85 °C
|
100 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
384 CLBS, 15000 GATES
|
250000 GATES
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
LBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY, LOW PROFILE
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1 mm
|
1.55 mm
|
| Supply Voltage-Max |
1.575 V
|
1.575 V
|
| Supply Voltage-Min |
1.14 V
|
1.14 V
|
| Supply Voltage-Nom |
1.2 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Pitch |
0.4 mm
|
1 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Width |
8 mm
|
13 mm
|
| Base Number Matches |
3
|
3
|
| Additional Feature |
|
TERM PITCH-MIN
|
| Clock Frequency-Max |
|
250 MHz
|
| JESD-609 Code |
|
e0
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
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